Cu-Graphene Paste/Powder

• 

• Cu-Graphene Paste
  -. Particle Size

  ITEM	Size
  	1.5㎛	400㎚
  Vacumm N2 Oven	200℃ 1hr	200℃ 1hr
  N2 Reflow	180℃ 5min 250℃ 20min	180℃ 5min 230℃ 20min

• Specific resistance

  

• Air Oven Type (Metal & Silk Mask) Cu-Graphene Paste

  

• Temperature/Humidity test (85oC, 85%)

  

• Thermal shock test (-40oC/30min~+80oC/30min,50 cycle)

  

Product name	Particle Size	Specific resistance	Viscosity (cps)
DSAM-CG Series	1.5㎛	3 mΩ.cm ↓	10,000~100,000
	400㎚	3 mΩ.cm ↓	10,000~100,000
	1.5um, 400n, Hybrid	3 mΩ.cm ↓	10,000~100,000

Application

Field	Purpose	Substrate	Advantage
Display Electrode	Ag → Cu-Graphene	Glass / Film	Low Cost
Touch panel	Ag → Cu-Graphene	PET / CPI / PI Film	Low Cost / High Flexible
Via Filling	Cu → Cu-Graphene	PCB / FPCB	Anti oxidation
Thick film heater	Ag, Pd → Cu-Graphene	SUS	Anti oxidation / High Fever

• Application field

  

  1. PTC heater (EV)
  2. Pattern printing
  3. Solar electrode circuit
  4. Heat dissipation material
  5. Via filling

• Reliability evaluation result

  

  ※ Cu-Graphene has the same reliability as Ag.

• SEM Image

  

  -. Binder Type
  1. Epoxy : Via filling / Heat dissipation material
  2. Polyester : Flexible Film
  3. Acryl : Pattern printing / Pattern printing Etc.

•  

  

Sintering Paste & Electrode Paste

• 

  Ag-Graphene Paste Migration Test Result

• Ag Paste & Cu-Graphene Paste

  ITEM	Ag Paste	Cu-Gr Paste
  	Particle Size
  	1~10 um	0.6~0.8 um
  Printable Thickness	5~50㎛	5㎛↓
  Heating Oven	Low Temp.100~200 High Temp. 250~700℃ 30~90min (Customized)
  Air Condition	Air/N2	N2

• Ag-Graphene Paste Migration Test Result

  

• -. Printing Type

  → Etc. (Customizing)
  -. Sintering Type : Heating, Light sintering
  -. Low Temp. Type : 100~200℃
  -. TGA : Sintering Ag or ACH Paste Hume : 10%↓
  -. bonding Type Adhesive Epoxy Type : 10.8W/mk

• 

• 

Product name	Particle Size	Specific resistance (200℃)	Viscosity (cps)
DSAM-AG Series	Ag Micro+Nano	1 mΩ.cm ↓	10,000~100,000
	Ag Micro	1 mΩ.cm ↓	10,000~100,000
DSAM-CG Series	Cu Micro+Nano	5~10 mΩ.cm ↓	10,000~100,000
	Cu Nano	3~5 mΩ.cm ↓	10,000~100,000

Application

Field	Purpose	Substrate	Advantage
Display Electrode	Ag → Ag Nano	Glass / Film	Low Resistance
Touch panel	Ag → Ag-Cu-Graphene	PET / CPI / PI Film	Low Cost / High Flexible
LED Bonding	Ag → Ag-Cu-Graphene	PCB / FPCB	Low Cost / High Adhesiveness
Thick film heater	Ag, Pd → Ag-Cu-Graphene	SUS	Low Cost / High Fever

DSAM-AG/CG Sintering Paste Series

• Introduction

  DSAM-AG/ACH/CG products are adhesive materials composed of silver (Ag) or copper-graphene particles, in the form of a paste used for chip bonding and die bonding.They possess high sintering performance, excellent adhesion, and heat dissipation characteristics, and can be used in both non-pressure and pressure processes

•  

  

Item	Unit	DSAM-AG	DSAM-CG (Cu-Graphene)
Viscosity(Pa.s)	Pa.s	70±5	50±5
Thixotropic Index(0.5/5rpm)		9	3±0.5
Viscosity Recovery rate	%	Below 10	Below 10
Thermal conductivity (250℃ 120min Non-Pressure)	W/mk	200~250	N2/Vac.
Thermal conductivity (280~300℃ 5min Pressure)	W/mk	250↑	150~180
Thermal conductivity (200~210℃ 60min Non Pressure)	W/mk	200~210	-
TGA (250℃ 30min)	%	90~95%	80~84%
Color		Silver	Brown
Resistivity (210℃ 60min Non-Pressure)	Ω·cm	4.0*10-6	-

• Non- Press Type Ag Paste

  

• Pressure Type CG(Cu-Graphene) Paste

  

• AG

  

• CG

  

• Working conditions

  - Drying: 100℃ 3min or 120℃ 1min
  - Temporary joint
  → NPR : After pre-drying, chip bonding and then main sintering.
  → PR : Temporary chip bonding after printing line drying is performed on a 5~10kg/100~150℃ plate.
  - Pressurized sintering conditions
  Pressure: 20MPa↓
  Peak Temperature: 250~300℃
  PR Hot Press Time: MAX. 3~5min
  NPR Time: MAX. 60~120min
  Atmosphere: Air or N2
  
  ※ Copper paste is prepared in a vacuum/ nitrogen atmosphere

• Storage method

  Epoxy Type (EP)
  Temperature: -10℃ or lower / Thaw 1 hour
  before work
  Storage period: 6 months
  Disposal principle after operation at room
  temperature
  - Resin Type(EC)
  Temperature: 0~10℃ / Thaw 1 hour before work
  Storage period: 12 months
  Disposal principle after operation at room temperature
  
  ※ If the above storage conditions are followed, the storage period is guaranteed.

Via Filling Paste

• 

• Paste Information

  ITEM	Particle Size
  	100nm~5um
  Filler Content	50~90%
  Heating Oven	150~200℃ 60min↑
  Air Condition	Air

• 

• -. Printing Type

  1. Screen Printing
  -. Sintering Type : Heating
  -. High Tg : 170~180℃
  - Low Permittivity
  - Low CTE

  

• 

• 

Product name	Viscosity (Pa.s)	Specific resistance (150℃)	Key Features
DSAM-I Series	10~100	Insulation	Permittivity : 3.0↓
DSAM-CS090EC	20±5	3.2*10-5	CTE : <20 Thermal Conductivity : >30

Application

Field	Purpose	Substrate	Advantage
Via Filling	-	Glass / PCB Via Hole	Low CTE / Low Cost
Heat dissipation	-	LED/Chiller system	Fast heat dissipation

Solder Paste

• 

• Solder Paste Reflow Profile

  

  Pre heating			Dwell			Cooling
  Time	Peak(˚C)	Max(˚C)	Time	˚C	Max(˚C)	˚C/sec	˚C
  144sec	150~190	200	72sec	215˚C↑	235~250	108sec	215~120

• Solder Ball & Wetting Test

  

• -. Sintering Type : Heating (Reflow Oven)
  -. Viscosity change : 6 month / Rate of change 15%↓
  -. Void : Max 3%↓
  -. Halogen Free

• Viscosity Evaluation Result

  

• Void Test (Max. 3%↓)

  

• Reflow Profile

  

Product name	Viscosity (Pa.s)	Alloy	Printing Guarantee Time	Other
DSAM-U/P/I Type6~Type9	200±30	SnAg3.0Cu0.5/SnCu0.7/In8	12h	Solvent Soluble : S Water Soluble : W
	200±30	SnAg3.0Cu0.5, S/W	12h
	200±30	Sn42Bi58, S/W	12h

Application

Field	Purpose	Substrate	Advantage
PCB Bumping	High Printability	PCB / FPCB	Low Viscosity Change Low Void Low Cost Fast delivery
SMT	High Printability	PCB / FPCB
Chip Bonding	High Tackiness	PCB / FPCB

• Void / Soldering

  

  1. Low Void (Max. 3%↓)
  2. Self alignment Test PASS

• soldering 성 및 Self Alignment 평가 결과

  

• IMC Data (SEM)

  

  -. IMC Data
  1. Alloy IMC formation PASS
  2. Reliability Test PASS

• IMC / Surface 평가 결과

  

Flux

• application of Ball Flux

  

• Product Image

  

•  

  

• Non-Clean Flux Result

  

Product name	Viscosity (Pa.s)	Cleaning Type	Printing Guarantee Time	Other
DSAM-WF001M	50±10	Solvent Soluble	12h	Halogen Free
DSAM-WF001	20±5	Water Soluble	12h	Non-Halogen
DSAM-NF002	50±10	Non Clean	12h	Non-Halogen TGA : 9%

Application

Field	Purpose	Substrate	Advantage
PCB Bumping	High Activation / Adhesiveness	PCB / FPCB/LED PKG	Low Viscosity Change Low Cost High Quality Fast delivery
Solder Ball Bonding	High Activation	PCB / FPCB